3D and Circuit Integration of MEMS
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English | 2021 | ISBN: 3527346473 | 502 pages | True PDF | 28.29 MB
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems
MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration.