Advanced Materials For Electronics Packaging
https://TutGee.com
MP4 | Video: h264, 1280x720 | Audio: AAC, 44.1 KHz, 2 Ch
Genre: eLearning | Language: English + srt | Duration: 31 lectures (55m) | Size: 308.7 MB
Become Expert In The Field Of "Advanced Electronics Material"
What you'll learn:
Need for electronics packaging
Different ICs packaging configurations
3 Packaging variations
Difference between various "FR" boards
Various Substrate materials
Materials used to form "Electronics Glass" & application of "Electronics Glass"
Various Ceramic Substrate materials that are currently being used and its technical details
Advanced "TIM" material : "GELVET"
Various metal matrix composites (MMCS) : Al-Diamond / AlSi / ASiC / Cu-Diamond / Al-Graphite
Role of Diamond
Carbon nanotubes (CNT) & its types : SWCNT / MWCNT
Applications of "CNTS"
Advanced materials used to form "PCM" - Phase Change Materials
Materials used for EMI (Electro-Magnetic Interference) shielding
Requirements
No prior skills required
Description
In this world of fast growing electronics technology & miniaturization process, thousands of new portable and light weight electronics products are launched in the market each day and in various fields of electronics such as - consumer electronics , medical electronics , communication electronics , defence electronics , industrial electronics and in aerospace electronics . Due to complex circuit design & miniaturization , excessive amount of heat dissipation is happening in electronics products which is reducing the life-span of the components/devices .Thus thermal management of all electronics products has become an important issue . In this role of thermal management, "electronics packaging" plays a very important part .
Here in this short course you will study in detail about the "advanced materials used in electronics packaging".